schottky barrier diode lrb520s - 30t1g maximum ratings (t a = 25 c) parameter symbol limits unit dc reverse voltage v r 30 v mean rectifying current i o 200 ma peak forward surge current i fsm 1a junction temperature t j 125 c storage temperature t stg -40~+125 c electrical characteristics( t a = 25 c ) parameter symbol min. ty p max. unit conditions forward voltage v f -- 0.60 v i f =200ma reverse current i r -- 1.0 av r =10v z applications low current rectification and high speed switching z features extremelysmall surface mounting type. (sc-79/sod523) low reverse current extremely fast switching speed z construction silicon epitaxial planar 1 2 cathode anode sod523/sc-79 1 2 device marking and ordering information device marking shipping lrb520s-30t1g 5j 3000/tape&reel lrb520s-30t3g 5j 10000/tape&reel leshan radio company, ltd. we declare that the material of product compliance with rohs requirements. extremely low forward voltage 0.6 v (max) @ if = 200ma z rev.a 1/3 total power dissipation@ta=25 d 150 mw c derate above 25 c p 1.2 mw/ c thermal resistance, junction to ambient rja 833 c/w s-lrb520s-30t1g s- prefix for automotive and other applications requiring unique site and control change requirements; aec-q101 qualified and ppap capable. z s-lrb520s-30t1g s-lrb520s-30t3g
0.001 0.01 0.1 1 0 100 200 300 400 500 600 -25 25 75 100 125 150 0.01 0.1 1 10 100 1000 0 1020304050 -25 25 75 100 125 150 0 5 10 15 20 25 30 35 0 10203040 electrical characteristic curves (ta=25 o c) lrb520s-30t1g,s-lrb520s-30t1g leshan radio company, ltd. forward current:if(a) forward voltage:vf(mv) reverse voltage:vr(v) reverse current :ir(ua) terminal capacitance : ct (pf) reverse voltage:vr(v) rev.a 2/3 fig.1 forward characteristics fig.2 reverse characteristics fig.3 vr-ct characteristics
sc - 79/sod - 523 leshan radio company, ltd. notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. maximum lead thickness includes lead finish. minimum lead thickness is the minimum thickness of base material. 4. dimensions d and e do not include mold flash, pro- trusions, or gate burrs. dim min nom max millimeters d 1.10 1.20 1.30 e 0.70 0.80 0.90 a 0.50 0.60 0.70 b 0.25 0.30 0.35 c 0.07 0.14 0.20 l 0.30 ref h 1.50 1.60 1.70 e l2 0.15 0.20 0.25 e d ? x ? ? y ? b 2x m 0.08 x y a h c 12 e top view side view soldering footprint* recommended 2x 0.48 0.40 2x 1.80 dimension: millimeters package outline rev.a 3/3 lrb520s-30t1g,s-lrb520s-30t1g
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